Tdev TMP5900

The TelcoBridges Tdev™ TMP5900 is a high-density computer telephony (CTI) development platform. While delivering seamless voice interoperability across TDM and IP networks, the TMP5900 provides an advanced application platform for delivering ring-back tones, unified communications, prepaid/post-paid calling, conferencing, Fax over IP (T.38), voicemail, and other enhanced services to subscribers, irrespective of access protocol or device.

Offering a full-featured quad-core Intel Xeon©-based host with 500GB of RAID-1 storage, the TMP5900 can run additional applications such as softswitches and session border controllers locally.

FEATURES & BENEFITS

Density: Supporting up to 64 T1/E1/J1, 3 DS-3 or 1 STM-1 interfaces in a single unit, offers the highest port density in a 2U form factor. Provides up to 2,048 IP voice ports at an industry leading lowest cost per port.

Carrier-grade: NEBS Level 3-compliant, the TMP5900 offers hot-swappable power supply redundancy and the ability to scale from 192 to 2,048 ports via hardware and software upgrades while providing full availability of call channels and other system resources (IVR, VOIP).

Flexibility: Supports multiple ‘any-to-any’ switching across multiple network interfaces and signaling protocols (SS7, ISDN, SIGTRAN, SIP and H.248) in the same device. With separate chipsets
for signalling, transcoding and interactive voice response (IVR), the TMP6400 provides true full channel availability.

High availability: The TMP5900 computer telephony platform features full redundancy with fault-tolerant hardware and software components.

AVAILABLE CONFIGURATIONS

TMP5910 – 8 x T1/E1/J1
TMP5912 – 16 x T1/E1/J1
TMP5914 – 32 x T1/E1/J1
TMP5916 – 48 x T1/E1/J1
TMP5918 – 64 x T1/E1/J1
TMP5920 – 1 x DS-3
TMP5922 – 2 x DS-3
TMP5924 – 3 x DS-3
TMP5930 – 1 x STM-1

Each configuration is available with AC or DC power.